AIC

Product
  • TB216-AA

    Features & Benefits
    TB216-AA, a NEBS/Telco Appliance Solution, supports one Intel® Xeon® Processor E3-1200 v3 Product Family, 4th Generation Intel® Core™ i3 Processor, or Intel® Pentium® or Celeron® Processor and 4 DIMM with 5+ year life cycle. TB216-AA harnesses MAX I/O™ technology, maximizing the usage of off-the-shelf expansion cards (up to 4) in the barebone.
    Product Image

    Key Features
    • 2U FIPS/NEBS compliant network appliance with 5+ years life cycle
    • Supports one Intel® Xeon® Processor E3-1200 v3 Product Family
    • Flexible I/O design with MAX I/O™ technology to support up to 3 COTS PCIe 3.0 add-in cards in a 20” depth 2U
    • Two server class GbE ports
    • Onboard Baseboard Management Controller for system management and IPMI control
    • Front-to-back airflow and hot swap redundant fans to provide optimal thermal conditions
    • Customizable to meet your requirements

     

    Dimensions (W x D x H) (with chassis ears)
    • mm : 482.6 x 541.8 x 88.8
    • inches : 19 x 21.3 x 3.5
    Motherboard
    AIC Server Board Ara
    Processor
    Processor Support : One Intel® Xeon® Processor E3-1200 v3 Product Family, 4th Generation Intel® Core™ i3 Processor, or Intel® Pentium® or Celeron® Processor
    Bus Speeds : DMI - 5 GT/s
    Socket Type : Socket H3 (FCLGA1150)
    Chipset
    Intel® C226 Chipset
    System Memory
    4 DIMM slots across 2 memory channels support up to 32GB of DDR3 1333/1600 ECC UDIMM
    Front Panel
    • Power on/off
    • System ID
    • System reset
    • NMI
    • USB 2.0 Type A connector
    • DB9 Serial port
    LEDs
    • Power
    • System ID
    • System management alert
    • Drive activity
    • Network activity
    • LCM
    Drive Bays
    Internal : 2 x 2.5” hot swap
    Expansion Slots (PCIe 3.0)
    1 x8 + 1 x8 (x4 mode) + 1 x4
    Riser Card (included)
    • PSG-RC-AA30-XXX6 (PSG Code: RC-PE2U01-TY) :
    2U Gold-finger x16 to to 2 PCIe x8 + 1 PCIe x4 riser
    System BIOS
    BIOS Type :
    • AMI EFI BIOS
    • SPI (Serial Peripheral Interface) FLASH Interface
    BIOS Features :
    • ACPI 1.0/2.0/3.0
    • PXE 2.0
    • WOL
    • AC loss recovery
    • IPMI KCS interface
    • SMBIOS 2.0
    • Serial console redirection
    On-board Devices
    SATA :
    Built-in SATA RAID controller on Intel® C226 Chipset w/ith software RAID support
    • 2 x SATA3 ports
    IPMI :
    Aspeed AST2400 Advanced PCIe Graphics & Remote Management Processor
    • Baseboard Management Controller (BMC)
    • Intelligent Platform Management Interface 2.0 (IPMI 2.0)
    • iKVM, Media redirection, IPMI over LAN, Serial over LAN
    • SMASH support
    Graphics :
    Aspeed AST2400 Advanced PCIe Graphics & Remote Management Processor
    • PCIe VGA/2D Controller
    • 1920x1200@60Hz 32bpp
    I/O Controller :
    Winbond W83627DHG
    Rear I/O
    • 2 x RJ45
    • 2 x USB 3.0 Type A
    • 1 x VGA
    • 1 x Serial
    Power Supply
    AC 450W 1+1 redundant high-efficiency power supply 80+
    • 90-264VAC, 47-63 Hz
    System Cooling
    3 x 60x56mm hot swap dual-rotor fans
    System Management
    • IPMI 2.0
    • KVM over IP
    • Media redirection
    • Temperature, fan, voltage, PSU sensor monitor
    • System temperature
    • System ID / System fail indicator
    • Remote power on/off/reset
    • SEL message alarm through mail
    • SNMP support
    • Intel NM
    Environmental Specifications
    • Operating temperature : 0° - 45°C
    • Storage temperature : -20° - 60°C
    • System relative humidity : 5% - 95% (38°C) non-condensing
    Gross Weight (w/PSU & Rail)
    • kgs : 22
    • lbs : 48.5
    Packaging Dimensions (W x D x H)
    • mm : 590 x 850 x 330
    • inches : 23.2 x 33.5 x 13
    Mounting
    Standard : 20'' fixed rail

    * All specifications are subject to change without notice.

    Built-to-order(BTO):
    Order Information:
    Industry Standard:
    Materials:
    Finish:
    Inside / Body:
    Outsize / Front:
    Dimensions:
    (W x D x H)
    mm: 0 x 0 x 0
    inches: " x " x "
    Cooling:
    Front:
    Middle:
    Rear:
    Expansion:
    Controls:
    Indicators:
    Speakers:
    System Board:
    Drive Bay:
    External
    5.25"
    3.5"
    3.5" hot-swap
    2.5" hot-swap
    Internal
    3.5"
    2.5"
    Slim CD-Rom/DVD-Rom
    Slim FDD
    Temperature:
    Humidity:
    Gross Weight:
    Package Dimension(W x D x H):   mm: x x
    Cubic Feet:
    Expander:
    Reference Container Loading: 20'
    40'
    40' H