AIC

Product
  • PSG-CB-1URCTDP01

    Features & Benefits
    1U 4-bay Dual DP Compute Node Bare-bone with redundant power supply, supports Dual/Quad Core processors. PSG-CB-1URCTDP0110 doubles the performance density and lowers the total cost of ownership (TCO).
    Product Image

    Features & Benefits
    • Dual Intel® 5520 + 2 x Intel® ICH10R with 5+ year life cycle
    • Flexible I/O usage with Max I/O - up to 2 OTS (off-the-shelf) cards in 1U
      (2 half-length, half-height)
    • 28" depth with redundant power, rear I/O
    • Front-to-back airflow provides optimal thermal conditions
    • Customizable to meet your requirements

    Specifications

    Motherboard
    Motherboard PSG-M-CTDP036D-110
    Dimensions
    W x D x H 17" x 28" x 1.75"
    Processor
    Processor • Quad-Core Intel® Xeon® Processor 5500 Series
    (W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, L5520, L5506)
    • Dual-Core Intel® Xeon® Processor 5500 Series (E5502)
    CPU Type • Four (4) FCLGA1366 socket
    • Supports single, dual, three (3) or four (4) Intel® Xeon® Processor 5500 series
    System Bus 800/1066/1333 MHz (DDR3 Memory)
    Front Panel

    Buttons

    • 2 x Power ON/OFF
    • 2 x System Reset
    • 2 x System ID

    LEDs

    • Power
    • Hard drive activity
    • Network activity
    • System warning
    Chassis
    Form Factor 1U
    Model PSG-CHS-CT1UCAR110
    Description 1U Castor Barebone Dual DP Appliance Node w/ Storage,
    4xHS 3.5" HDD
    Drive Bays
    Drive Bays 4 x 3.5" hot-swap hard drive trays
    Expansion Slots
    Expansion Slots 2 x PCIe x8
    System Memory
    System Memory 24 240-pin DIMM sockets
    • Supports up to 384 GB of DDR3 800/1066/1333 MHz
    Registered ECC SDRAM
    System BIOS
    BIOS Type AMI BIOS
    SPI (Serial Peripheral Interface) FLASH Interface

    BIOS Features

    • ACPI 1.0/2.0/3.0
    • PXE 2.0
    • AC loss recovery
    • IPMI KCS interface
    • SMBIOS 2.0
    • Serial console re-direction
    On-Board Devices
    Chipset • Two (2) x Intel® 5520 Chipsets (Tylersburg-EP)
    • Two (2) x Intel® ICH10R
    SATA Built-in Intel® ICH10R SATA2 controllers with RAID support
    • RAID 0, 1, 5, 10 (Windows)
    • RAID 0, 1, 10 (Linux)

    IPMI

    Aspeed AST2050 BMC
    • Intelligent Platform Management Interface 2.0 (IPMI 2.0)
    • iKVM, Media Re-direction, IPMI over LAN, Serial over LAN
    • SMASH support

    Network Controllers

    • 2 x Intel® 82571EB (Ophir) PCI Express dual-port GbE controller; MAC/PHY/SerDes
    • 2 x Intel® 82574L PCI Express single-port GbE controller
    • 2 x Intel® 82567LM GLCI on ICH10 single-port GbE PHY

    Graphics

    Two (2) Aspeed AST2050 graphics controller
    • Up to 128 MB of memory
    • 1600 x 1200 @ 60 Hz, 16bpp
    Super I/O Two (2) Winbond W83627DHG
    SATA/SAS Backplane
    SATA/SAS BP One (1) SAS/SATA multi-lane (4) backplane
    Input/Output
    Serial ATA 8 x SATA2 ports
    LAN 8 x RJ45 ports
    USB 6 x USB ports (2 rear + 1 front)
    VGA 2 x External VGA port
    2 Internal VGA port pin-header

    Serial Port

    2 x External DB-9 serial port
    2 x Internal DB-9 serial port pin-header
    Power Supply

    Power Supply

    650W power supply
    • 1U redundant (1+1)
    • 90-264VAC, 47-63 Hz
    • Independent MB power control
    System Cooling

    System Cooling

    6 x 40mm x 56mm, 15.8K rpm
    System Management
    System Management • IPMI 2.0 compliance
    • KVM over IP
    • Media re-direction
    • CPU temperature (PCEI)
    • System temperature
    • Fan speed detection
    • Smart Fan speed control
    • System ID / System fail indicator
    • SMASH support
    • Remote Power ON/OFF/Reset
    Operating Environment
    Environmental Specifications • Operating Temperature: 0 ~ 40°C
    • Operating Altitude Condition: 0 ~ 10K feet
    • Storage Temperature: -20 ~ 60 °C
    • System Relative Humidity: 5% to 95% (38°C) non-condensing

    * All specifications and photos are subject to change without notice.

    Built-to-order(BTO):
    Order Information:
    Industry Standard:
    Materials:
    Finish:
    Inside / Body:
    Outsize / Front:
    Dimensions:
    (W x D x H)
    mm: 0 x 0 x 0
    inches: " x " x "
    Cooling:
    Front:
    Middle:
    Rear:
    Expansion:
    Controls:
    Indicators:
    Speakers:
    System Board:
    Drive Bay:
    External
    5.25"
    3.5"
    3.5" hot-swap
    2.5" hot-swap
    Internal
    3.5"
    2.5"
    Slim CD-Rom/DVD-Rom
    Slim FDD
    Temperature:
    Humidity:
    Gross Weight:
    Package Dimension(W x D x H):   mm: x x
    Cubic Feet:
    Expander:
    Reference Container Loading: 20'
    40'
    40' H