AIC

Product
  • Ara

    Features & Benefits
    The Ara series server board offers compelling performance and improved power efficiency, which is optimized for performance platforms (storage, security and communications infrastructure).
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    Product Overview

    The Ara series server board offers compelling performance and improved power efficiency, which is optimized for performance platforms (storage, security and communications infrastructure).

    By implementing the next-generation 22nm/14nm Intel® Xeon® processor E3-1200 v3/v4 series, fully integrated microarchitecture with AIC-patented MAX I/ O™ technology, the Ara server board provides for maximum flexibility of I/O usage, never before available in the industry.

    The Ara features benefits of the Haswell processor and Next Generation architecture with available Gen 3 PCI Express and more memory support. Built upon the MAX I/O™ technology, the Ara series allows users to maximize the input/output (I/O) usage by utilizing the PCI Express directly at the source and eliminating the need for expensive switches. Users can cost-effectively manage PCI Express with the available bandwidth by choosing one of many riser cards for their IO expansion requirement. Max I/O™ supports any brand of PCI-based HBAs and that puts the decision of how to use PCI Express in the hands of the user, not in the hands of the board supplier.

    The unique RTX form factor utilizes full internal chassis height for optimum I/O configurations.

    Features & Benefits
    • Supports one Intel® Xeon® Processor E3-1200 v3/v4 Product Family, 4th Generation Intel® Core™ i3 Processor, or Intel® Pentium® or Celeron® Processor for entry-level server or network appliance solutions
    • Embedded components for 5+ years life cycle
    • Flexible I/O usage with Max I/O™ to support an optimal number of PCI devices utilizing 16 lanes of PCIe Gen3 and one PCIe Gen2 x4 slot
    • 2 server class GbE ports
    • Onboard Baseboard Management Controller for system management and IPMI control
    • Rackmount Technology Extension (RTX) form factor utilizes full internal chassis volume for optimum I/O configurations

     

    Specifications

    System
    Dimensions :
    • mm : 330 x 152.4
    • inches : 13 x 6
    Processor Support :
    One Intel® Xeon® Processor E3-1200 v3/v4 Product Family, 4th Generation Intel® Core™ i3 Processor, or Intel® Pentium® or Celeron® Processor
    Bus Speeds :
    DMI - 5 GT/s
    Socket Type :
    Socket H3 (FCLGA1150)
    System Chipset :
    Intel® C226 Chipset
    System Memory :
    • 4 x DIMM slots support DDR3 1866/1600/1333 MHz Unbuffer ECC/non-ECC
    • Up to 32GB UDIMM
    Expansion Slots :
    • 1 x PCIe x16 Gen 3 Gold-finger
    • 1 x PCIe x8 onboard slot (x4 Gen 2 mode)
    System BIOS
    BIOS Type :
    AMI BIOS
    BIOS Features :
    SPI Interface
    On-board Devices
    SATA :
    6 x SATA3 ports
    BMC :
    Aspeed AST2400 Advanced PCIe Graphics & Remote Management Processor
    • Baseboard Management Controller (BMC)
    - IPMI 2.0 spec
    - iKVM, Media redirection, SMASH support
    - KCS (Keyboard Controller Style), IOL (IPMI Over LAN), SOL (Serial Over LAN) interface
    - Temp, voltage and fan speed monitoring
    - Smart fan speed control
    - System identity, fan fail alarm, system status alarm LED
    - Remote power ON/OFF/RESET
    - RMCP+, SNMP, DHCP in IOL support
    - AES-128 encryption in RMCP+
    Network Controller :
    • Intel® Ethernet Controller I210-AT, single port GbE, PCIe v2.1
    • Intel® Ethernet Connection I217-LM, single port, 1Gbps
    Graphics :
    Aspeed AST2400 Advanced PCIe Graphics & Remote Management Processor
    • 2D Video Graphic Adapter w/ PCIe bus interface
    • 1920x1200@60Hz 32bpp
    Input/Output
    LAN :
    2 x RJ45 GigaLAN double-stack connectors
    USB :
    • 2 x USB 3.0 double-stack Type A connectors
    • 1 x USB internal pin-header to support 2 x USB 3.0 + 2 x USB 2.0
    VGA :
    1 x DB-15
    Serial Port :
    1 x DB-9

    * All specifications are subject to change without notice.

    Built-to-order(BTO):
    Order Information:
    Industry Standard:
    Materials:
    Finish:
    Inside / Body:
    Outsize / Front:
    Dimensions:
    (W x D x H)
    mm: 0 x 0 x 0
    inches: " x " x "
    Cooling:
    Front:
    Middle:
    Rear:
    Expansion:
    Controls:
    Indicators:
    Speakers:
    System Board:
    Drive Bay:
    External
    5.25"
    3.5"
    3.5" hot-swap
    2.5" hot-swap
    Internal
    3.5"
    2.5"
    Slim CD-Rom/DVD-Rom
    Slim FDD
    Temperature:
    Humidity:
    Gross Weight:
    Package Dimension(W x D x H):   mm: x x
    Cubic Feet:
    Expander:
    Reference Container Loading: 20'
    40'
    40' H